分类:Technology 的存档信息

Versatile ICs From Thinned Si

As such, adaptable ICs are starting to emerge, together with the technological solution adhering to 2 divergent paths. The main is usually to thin present Si chips by grinding them to just above the main junction. The fragile thin die, with thicknesses as little as ten um, is encapsulated inside of a slim layer of polyimide so as to add fracture … (阅读全文)